Dell was granted a patent for improved differential-via PCB design.

{
  "signal_id": "097069ee-8bc4-55c9-b04e-10728e9a3487",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-10-30T01:05:31+00:00",
  "company": {
    "name": "Dell",
    "domain": "dell.com"
  },
  "data": {
    "cpc": [
      {
        "code": "H05K 1/0245",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 1/0298",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 1/115",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      },
      {
        "code": "H05K 2201/09536",
        "label": "Printed circuits; casings; manufacture of electrical assemblages"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Engineering",
      "Product Development"
    ],
    "detail": "In October 2026 Dell patented printed-circuit-board routing technology for information-handling systems, helping differential signals maintain better electrical performance.",
    "summary": "Dell was granted a patent for improved differential-via PCB design.",
    "event_at": "2026-10-27",
    "inventors": [
      {
        "name": "Chang-Kai Chu",
        "status": "unresolved",
        "is_primary": true
      },
      {
        "name": "Chang-Hsien Chen",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Yi-Tang Chen",
        "status": "unresolved",
        "is_primary": false
      },
      {
        "name": "Bhyrav Mutnury",
        "status": "unresolved",
        "is_primary": false
      }
    ],
    "tech_area": "PCB / electronics packaging",
    "event_kind": "grant_date",
    "grant_date": "2026-10-27",
    "source_url": "https://patents.google.com/patent/US12777576",
    "cpc_primary": {
      "code": "H05K 1/0245",
      "label": "Printed circuits; casings; manufacture of electrical assemblages"
    },
    "patent_title": "Dual differential via design on a printed circuit board",
    "patent_number": "US12777576",
    "uspto_assignee": "Dell Products L.P.",
    "patent_abstract": "An information handling system includes a printed circuit board having first and second vias fabricated through the printed circuit board. The first via includes a first conductive metal plating and first and second via portions. The first via portion is connected to a first ground trace of the printed circuit board. The second via portion is connected to a first trace of a differential pair. The first and second via portions are formed in the first conductive metal plating. The second via includes a second conductive metal plating and third and fourth via portions. The third via portion is connected to a second ground trace the printed circuit board. The fourth via portion is connected to a second trace of the differential pair. The third and fourth via portions are formed in the second conductive metal plating.",
    "precision_class": "structural",
    "invention_explanation": "A circuit-board via design that connects differential signal traces and ground through carefully shaped plated sections to reduce signal interference.",
    "technologies_mentioned": [
      "printed circuit boards",
      "differential signaling",
      "vias",
      "electronics packaging"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/097069ee-8bc4-55c9-b04e-10728e9a3487 \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"dell.com","limit":20}'