Neuralink was granted a patent for a sealed implant wire enclosure.

{
  "signal_id": "502cd723-6f2e-5b17-9fc2-d3af449b7b61",
  "signal_type": "patents-company",
  "signal_subtype": "patentGrant",
  "detected_at": "2026-10-29T23:49:55+00:00",
  "company": {
    "name": "Neuralink",
    "domain": "neuralink.com"
  },
  "data": {
    "cpc": [
      {
        "code": "A61B 5/6868"
      },
      {
        "code": "A61B 5/293"
      },
      {
        "code": "A61N 1/3754"
      },
      {
        "code": "H01B 3/306"
      },
      {
        "code": "H01B 7/048"
      }
    ],
    "tags": [
      "Intellectual Property",
      "Research & Development",
      "Healthcare Technology",
      "Medical Research"
    ],
    "detail": "In October 2026 Neuralink patented a polymer enclosure for protecting closely spaced electrical connections in implantable medical devices.",
    "summary": "Neuralink was granted a patent for a sealed implant wire enclosure.",
    "event_at": "2026-10-27",
    "inventors": [
      {
        "name": "Ik Soo Kwon",
        "status": "resolved",
        "is_primary": true,
        "linkedin_url": "https://www.linkedin.com/in/ik-soo-kwon-77922293"
      },
      {
        "name": "Dongjin Seo",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/seodj"
      },
      {
        "name": "John W.F. To",
        "status": "resolved",
        "is_primary": false,
        "linkedin_url": "https://www.linkedin.com/in/john-wf-to"
      }
    ],
    "event_kind": "grant_date",
    "grant_date": "2026-10-27",
    "source_url": "https://patents.google.com/patent/US12773167",
    "cpc_primary": {
      "code": "A61B 5/6868"
    },
    "patent_title": "Polymer enclosure with wire passthrough for implantable device",
    "patent_number": "US12773167",
    "uspto_assignee": "Neuralink Corp.",
    "patent_abstract": "An implantable device and method of manufacture include a substantially hermetic polychlorotrifluoroethylene (PCTFE) enclosure with closely-spaced wires extending through a slit in the enclosure. A method for manufacturing the implantable device includes cutting a slit in a piece of polymer and extending a plurality of insulated wires through the slit. Each of the insulated wires are parallel to a neighboring wire of the insulated wires. The piece of polymer is thermally bonded around each wire of the plurality of insulated wires such that the piece of polymer is sealed around insulation of each wire with a portion of each wire extending through the piece of polymer.",
    "precision_class": "structural",
    "invention_explanation": "A sealed plastic casing lets parallel insulated wires pass through a narrow opening while bonding tightly around them to help keep body fluids out.",
    "technologies_mentioned": [
      "implantable devices",
      "hermetic enclosures",
      "polymer manufacturing",
      "neural interfaces"
    ]
  }
}

curl https://signals.autobound.ai/v1/signals/502cd723-6f2e-5b17-9fc2-d3af449b7b61 \
  -H "X-API-KEY: $AUTOBOUND_API_KEY"

curl -X POST https://signals.autobound.ai/v1/companies/enrich \
  -H "X-API-KEY: $AUTOBOUND_API_KEY" \
  -H "Content-Type: application/json" \
  -d '{"domain":"neuralink.com","limit":20}'