Qualcomm partners with Huawei in chip technology: LogicFolding's impact on the global industry

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  "signal_type": "news",
  "signal_subtype": "partners_with",
  "detected_at": "2026-10-05T10:21:06+00:00",
  "company": {
    "name": "Qualcomm",
    "domain": "qualcomm.com"
  },
  "data": {
    "url": "https://gagadget.de/728614-qualcomm-schliesst-partnerschaft-mit-huawei-in-der-chiptechnologie-der-einfluss-von-logicfolding-auf-die-globale-industrie/",
    "title": "Qualcomm partners with Huawei in chip technology: LogicFolding's impact on the global industry - gagadget.de",
    "excerpt": "Qualcomm and Huawei have signed a multi-year agreement for the mutual use of patents, including LogicFolding, the technology Huawei uses to manufacture its latest chips. Bloomberg reports this, citing a representative of the Chinese side. The fact that the main Western rival is paying to use Huawei's technology speaks volumes about what the brand has achieved despite the sanctions. Nevertheless, phones with this chip will not be sold in Spain.\nThe United States prevents Chinese manufacturers from accessing ASML's EUV lithography machines, which enable increasingly smaller transistors. Huawei responds with engineering ingenuity: LogicFolding combines two silicon layers in a single package. The bottom layer handles calculations, while the top layer houses the cache and SRAM (very fast memory integrated into the processor). This way, more transistors and more memory can be accommodated without increasing the chip's size. It is a global trend, called 3D packaging, where speed between layers is more important than nanometers.\nThe technology is already in operation in the Kirin 9050 Pro, which surpasses Apple's A17 Pro in multithreading, although it is still far from Apple's latest chips. Huawei already has more than 165,000 active patents and is increasingly demanding fees for them. In 2024, it collected approximately 630 million dollars in licenses. With this agreement, the total...",
    "summary": "Qualcomm has signed a multi-year agreement with Huawei for the mutual use of patents, including Huawei's LogicFolding chip manufacturing technology.",
    "planning": false,
    "image_url": "https://gagadget.de/media/cache/fe/6f/fe6f1ffed8e5d3c9759d24a948d46ab2.webp",
    "confidence": 0.9,
    "published_at": "2026-10-05T10:21:06Z",
    "article_sentence": "Qualcomm and Huawei have signed a multi-year agreement for the mutual use of patents, including LogicFolding, the technology Huawei uses to manufacture its latest chips.",
    "related_company_name": "Huawei",
    "related_company_domain": "huawei.com"
  }
}

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